logo
Construction Engineering - Building Envelope Design and Modelling Lab

Building Envelope Design and Modelling Lab


Synthetic program:

The aim of the Building Envelope Design Lab is to provide knowledge and expertise to develop architectural surfaces from conceptual design to fabrication using advanced software and tools. Daylighting strategies are used to find envelopes able to cope with energy performance, users’ requirements and architectural integration. The course is structured in three parts: Daylighting and design of responsive skins lectures, Seminars and Student projects. Daylighting and design of responsive skins lectures: lessons will be devoted to the analysis of case studies representing the behaviour of different façade typologies, focusing on geometries and movement, users’ behaviour, daylighting simulations and construction materials and technologies. Seminars: special lectures will be carried out by academic and professional experts that works on the topic of building envelopes, biomimicry and fabrication techniques. Student projects: the practical part of the course will be related to the development of a design concept for a building located in different places of the world. Tutors will assist students during all the process that leads from the design concept to the fabrication of a model at small scale, constructed within the laboratories of the Politecnico di Milano. By the end of the course, students will demonstrate how to: - Evolve the concept by critical and technical analyses emerged during the conception of the building component/envelope. - Connect design concepts with material strategies and architectural technology. - Work with computational tools in order to facilitate the link between digital design, daylight and thermal simulations and physical construction. - Present and communicate research findings as part of a group and individually. - Contribute and share knowledge as part of an interdisciplinary professional team.

HEAT TRANSFER THROUGH WALLS Steady periodic heat transfer Parameters for dynamic heat transfer through a wall: self admittance, transfer admittance, effusivity Methods for Numerical solution of the conduction equation in walls Moisture transfer in air and by air MOISTURE MOVEMENT IN BUILDINGS - Diffusion - Convection MOISTURE TRANSFER IN POROUS MATERIALS - Diffusion - Capillarity suction --- Moisture balance for building components --- Moisture balance for ventilated spaces --- Interstitial condensation - Calculation methods for Steady conditions - Calculation methods for Dynamic conditions APPLICATIONS Examples relevant to building design, operation and refurbishment By using available software tools (e.g. WUFI) , spreadsheets, etc.

Lecture Notes

Complete course:

Type File name Year
File not available...

Divided by topic:

Type File name Year
File not available...

Other:

Type File name Year
File not available...

Exercises

Complete course:

Type File name Year
Digital notes Exercise 3 2018/2019
Digital notes Exercise 1 2016/2017

Divided by topic:

Type File name Year
Digital notes Homework - 1 2017/2018
Digital notes Homework - 2 2017/2018
Digital notes Homework - 3 2017/2018

Other:

Type File name Year
File not available...

Exams

First partial exam:

Type Date
File not available...

Second partial exam:

Type Date
File not available...

Full exam:

Type Date
File not available...

Oral exam:

Type Date
File not available...

Multiple choice test:

Type Date
File not available...

Other:

File name
File not available...

Other

Laboratory:

File name Year
File not available...

Projects:

File name Year
Case Study 2017/2018
Final report 2017/2018

Presentations:

File name Year
File not available...

Collections of notes, exercises or exams:

File name Year
File not available...

Tables:

File name Year
File not available...

Etc:

File name Year
File not available...

Live

Quick daily notes, exercises and audio recordings. Files will be approved on priority but deleted after 365 days. 2 points will be assigned by default.

Quick contents:

File name Date
File not available...